Chip-Off Forensics 2.0

This five-day class provides students with the skills required to properly remove a BGA memory chip from a mobile device, prepare the memory for a read, and use chip-reading equipment to acquire the data.

Students will spend 2.5 days understanding the structure of devices and best practices to prevent damage to a chip during removal and preparation. Understanding the difference between memory structures -from a mobile device, to tablet, to SSD hard drive – and how chip-off can be utilized to acquire data from a growing number of devices – the class enables examiners to get a handle on the growing trend of BGA memory use.

In the chip-reading portion of the class, students will learn the fundamentals of memory structure and how to utilize the tools available to read the memory off the chip. Students will get a complete hands-on experience beginning with a cell phone or an IOT device loaded with data, and ending with the raw data acquired from the removed and read the chip. The processes taught in this class can be applied to many types of devices like Cell Phones, Infotainment systems and IOT devices. Students will get a complete hands-on experience beginning with an intact BlackBerry device loaded with data, and ending with the raw data acquired from the removed and read the chip. Once the data is acquired, an education on how to best apply today’s tools and other techniques to decode the data follows. Students taking the Chip-off technique should possess advanced skills in data analysis and be comfortable working with raw data at the post-acquisition phase of the course.

Students taking the Chip-off technique should possess advanced skills in data analysis and be comfortable working with raw data at the post-acquisition phase of the course.

This course is reserved for Law Enforcement Only, or in certain cases examiners that have been contracted by a Law Enforcement, Military or Government Agency.

Due to the sensitive nature of our curriculum, and industry, all potential students are subject to vetting prior to enrollment. We reserve the right to refuse registration to any person that does not meet our established criteria.

• Martview Reballing Stencil Kit (Full Set) with Fixed Plate & Magnetic Base.
• Diagonal BGA Ball Mounting Table for Chip Rework & Repair
• Solder Paste & Flat Scraper/Sealing Tool for Phone Repair
• Glue Removal Blade Set
• Bent Blade Kit for Screen Debonding & Removal

*Due to frequent updates and changes in equipment, actual training and class giveaways may change.

Day 1 Overview

• Chip-Off Introduction
• Chip-Off Heat Process
• Hands on Practical’s for Heat Removal/Cleaning/Tinning of Chips

Day 2 Overview

• Characteristics of Flash Memory
• UP828 & UP828P Programmers
• 2 Stage Reballing of BGA Chips
• Hands on Practical’s for Heat Removal Process and Reballing

Day 3 Overview

• Non-Heat Milling BGA Chips
• Non-Heat Polishing Process
• Hands on Practical’s for Heat and Non-Heat Processes

Day 4 Overview

• Medusa eMMC Box
• Alternative Reading Tools
• Package on Package
• Hands on Practical’s for Heat/Non-Heat Processes and Package on Package Chips

Day 5 Overview

• Dediprog UFS Programmer
• Resources and Data Sheets
• Certification Process
• Hands on Practical’s For All Processes Taught In This Class

Evaluation Procedures:

Students will be asked to complete several practical exercises that will provide the instructor with an idea of their understanding of the course material. Successful students will receive their Teel Tech Chip-off 2.0 Certification.

• Windows PC with two (2) USB A ports.
• Windows OS
• macOS with Bootcamp Windows
• macOS alone will not work (No Virtual Machines)
• 8GB RAM (minimum)
• 100GB storage (minimum)
• You must have admin rights or have the admin password for software installation.
• NOTE: ALL Windows updates should be done prior to class.

Optional

• Cellebrite P.A. Dongle
• Encase, FTK, X-Ways Dongle
• Access to a HEX editor
• External USB 3.0 Storage Device